Includes 2 dimensional inspections, 3 dimensional inspections and 4-way oblique imaging inspections all in one unit! TypeHS2 realizes highest level inspection speed by further accelerating TypeHS.
The YSi-V is the first in the industry to utilize both a 12Megapixels industrial grade high-resolution camera, along with a high-pixel compatible telecentric lens having the high-resolution indispensable for high-accuracy inspections.
In addition to the 12μm lens, the lineup also includes a 7μm lens that enables higher resolution inspection. Adding a high-speed image processing control system and other features achieves high-speed along with high-accuracy and expanded field of vision.
High-speed measurement achieved by raising all viewing field heights.
2-D imaging reliably detects floating or unseated parts etc. even in tough, hard-to-find cases.
The 7μm lens capable of high-definition inspection includes inspection function for ultra-tiny 0201 chips that employs a newly designed high magnification projector.
Besides 2-dimensional inspection from directly above the PCB, gives batch imaging of the entire field of vision by 4-direction sideview inspection with no tact loss! This also allows visual inspections without having to touch the PCB, since imaging allows checking the PCB in 4 directions just as if you’re holding it in your hand. This also helps prevent operator errors and drastically shortens the process time. Also supports automatic inspections for defects not visible from directly above the PCB such as solder bridges between pins under component bodies.
The inspection history management software iProDB lets you monitor the status of mounters, printers, and inspectors all in just a glance! The iProDB amasses test result data to calculates potential trouble warning signs. It gives vital intelligent quality (IT) support it applies to process improvements.
Inferior images are sent to the operator’s mobile unit via a wireless LAN, which makes it possible to judge pass or fail remotely. The system allows line operators to also make decisions, contributing to labor savings.
The system can directly convert all types of data (e.g., CAD, CAM, and mounter data) into inspection data and automatically creates PCB images from Gerber data. The system detects through holes on DIP PCBs automatically and can create inspection data automatically.
AI automatically identifies the component types based on images taken by the camera and applies the optimum component library automatically, contributing to simplifying the inspection data creation.
Specifications and appearance are subject to change without prior notice.
